Senior Engineer, Unit Process Modeling

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next-generation Digital Twins, predictive modeling solutions, and AI-driven technologies that accelerate advanced memory development and manufacturing excellence.  You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM.  Leveraging physics-based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co-optimization, design-space exploration, process optimization, yield improvement, and accelerated technology learning.  Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost.  This role offers the opportunity to influence critical technology decisions, drive  fab-technology co-optimization , and advance Micron's leadership in data-driven semiconductor memory innovation.

Independence – be comfortable executing activities and needs Experience in algorithm development, numerical methods, and scientific computing Solid experience with Plasma, FPM, HAR etching, and MC modeling Experience with Wet Processes, Chemical Etching and Strip, Material selectivity, Chemistry evaluation, etc. Strong background in thermodynamics, physics, and chemistry Experience with computational materials science methodologies Familiar with machine learning and deep learning concepts and applications Experience with regression, neural networks, and frameworks Familiar with process and multi-physics modeling, and implementation Experience with common modeling software, previous software development and Linux experience Experience with Bash, Python, FORTRAN, or C++ Experience with OpenFOAM, ANSYS Fluent, COMSOL, HPEM Strong debug and problem-solving skills Experience writing reports and conference papers Excellent written and verbal communication Ability to work in a team environment and experience with remote collaboration tools   Responsibilities Develop and deploy Digital Twins and predictive models spanning process, wafer, die, package, and manufacturing domains to enable technology and fab co-optimization. Develop structural and Multiphysics models to evaluate process-structure-performance interactions, including stress, deformation, cracking, voiding, and reliability risks. Build physics-informed composite AI models that accelerate technology development, yield improvement, reliability assessment, and design-space exploration. Apply advanced computational methods, machine learning, and sparse-data modeling techniques to create robust predictive and prescriptive solutions for complex semiconductor challenges. Utilize state-of-the-art GenAI, LLM-powered copilots, RAG systems, and agentic AI workflows that integrate engineering tools, knowledge bases, simulation environments, and manufacturing data. Collaborate across global engineering teams to translate modeling insights into actionable technology decisions. Experience : 5+ years of modeling Education : Ph.D. in Applied Chemistry, Applied Physics, Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related fields. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life   for all .