2nd Shift Etch Process Support Engineer

Location: US-MA-ANDOVER-AR2 ~ 362 Lowell St ~ AR2 PLYMOUTH BLDG

 Position Role Type: Onsite

 U.S. Citizen, U.S. Person, or Immigration Status Requirements: U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract.

 Security Clearance Type: DoD Clearance: Secret

 Security Clearance Status: Active and existing security clearance required after day 1 At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

An exciting opportunity exists at Raytheon to join our process support team as a 2nd Shift Etch Process Support Engineer . This role involves working with gallium arsenide, gallium nitride, and III-V focal plane array materials within the RF Microelectronics/Module Design & Foundry Services (RFMicro) Department. This role requires a basic understanding of microelectronics processing techniques such as wet etching, dry etching, and plating. As a member of the RFMicro Department, the individual will be responsible for all etch related processes of the semiconductor products fabricated in the Andover foundry. Daily duties include engineering support and training for manufacturing personnel, reviewing lots and wafers requiring special disposition, failure analysis of tools and processes, supporting work center leads in tool and process qualification efforts, looking for ways to reduce rework and scrap, and looking for ways to increase efficiency in the process line. A significant portion of the role involves communicating with the manufacturing personnel, equipment teams, cell leads, and engineering leads to ensure the work center has the necessary resources to function efficiently. Presence on the manufacturing floor is required for quick resolution of issues and quick reaction time to prevent interruption to customer commitments. The ideal candidate will be an excellent communicator and have a drive to learn and improve the areas in which they work. Ability to multitask with attention to detail, maintain organized and documented processes, and the ability to work well in small cross-functional teams is essential. This role will be 100% on-site and based in Andover, MA.

Processing wafers to create FETs, MMICs, and FPAs in a cleanroom environment. Work autonomously with limited oversight. Influence others regarding policies, practices, and procedures. Review and disposition wafers on hold for evaluation in the work center Work well in small, cross-functional teams, assist in maintaining or improving production processes. Actively communicate with parties within and outside of the work center (other shift engineers, work center leads, operation leads, manufacturing personnel, equipment team, etc.) Qualifications You Must Have: Typically requires a Bachelors Degree in Science, Technology, Engineering or Mathematics (STEM) A minimum of 3 years of prior relevant experience with microelectronics processing techniques such as wet etching, dry etching, and plating. The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance.

We Prefer: An advanced degree in Science, Technology, Engineering, or Mathematics (STEM) Clearly and succinctly document and present process development status in meetings Knowledge related to semiconductor processing and data analysis Experience utilizing data analysis software packages (e.g. MATLAB, Python, SQL, JMP). Experience with quality standards