Chip Lead / ASIC Director

WHAT YOU DO AT AMD CHANGES EVERYTHING   At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.   Together, we advance your career.

As ASIC Director – Chip Lead in our Product Development  team, you will be responsible for providing technical leadership to one or more Adaptive & Embedded Computing Group (AECG) device programs. You will have sign-off responsibility for the technical execution of device programs from conception & planning to release to manufacturing. Your leadership responsibilities will focus on problem solving in all aspects of the device development cycle  including architecture, RTL, analog & custom design, design for test & manufacturing, verification, physical design & timing closure, physical verification, tapeout and post-silicon validation & qualification.  When a problem does not clearly fall under the banner of one technical team or another it becomes the responsibility of the Chip Lead to bring expertise, experience and diplomacy together to coordinate a solution.     The Person   This position requires a wide breadth of understanding of and experience with ASIC design and development.  It also requires strong interpersonal skills to resolve issues between highly skilled and experienced engineering colleagues.  A successful candidate will work with senior silicon design engineers, architects, and micro-architects from a wide variety of technical teams. The candidate will be attuned to the overall goals and objectives of the program and employ excellent communication and problem-solving skills.

Chip Definition and Feasibility – identify critical tradeoffs and architectural decisions   Advise on Feasibility including early estimates of Schedule, Cost, Size, Power, Floorplan,    and identify key implementation decisions   Serve as Engineering’s interface to Technical Marketing; ensuring the product meets customer needs and supports the required functions and usage modes   Define/identify new device specific functionality (with Marketing and Architecture)    When needed, negotiate for a new, new version or new variant of an IP (with the IP/COE Lead)   Be aware of devices and programs throughout the organization;  foster engineering re-use   Help resolve issues and guide trade-offs that arise during any phase of the program but especially in Physical Design.   Execution   The Chip Lead works with one or more Program Managers:  The Program Manager tracks that IP and chip development milestones and deliverables are achieved as scheduled. The Chip Lead engages and resolves the problem when some aspect of the program is not meeting its planned objectives.     When engineering or marketing initiates a change to the program, the Chip Lead communicates the change and its consequences to all stakeholders.

Experience required in ASIC Development Lifecycle. FPGA technical experience is a huge plus    Experience in a leadership role with a semiconductor company   Master’s or PhD in Electrical Engineering, Computer Engineering, or related technical field   Post-silicon validation experience is a strong asset   Strong understanding of semiconductor industry and products. Experience working with Product Planning and Marketing teams is