Staff PTD Metrology Engineer
Seagate Technology
- Work model
- On-Site
- Level
- Staff
About this role
About our group
The Staff Engineer in PTD Metrology is responsible for driving Seagate’s HOC technology roadmap and supporting new product development by establishing advanced metrology capabilities for ultra-thin film characterization, including XRF, Ellipsometry, XRR, Raman, and Micro-XRF. This role ensures strong alignment between technology development maturity, product roadmap requirements, and execution timelines. The engineer will lead development programs and foster cross-functional collaboration to deliver robust and reliable metrology solutions to the production environment. About the role - you will:
Key Responsibilities
Lead the development of HOC thickness metrology for DLC and other thin film coatings Perform, optimize, and standardize measurements using XRF, Ellipsometry, XRR, and Raman, Micro-XRF Improve measurement accuracy, repeatability, and Gage R&R performance Support process development teams in coating optimization and yield improvement Drive cross-platform correlation across XRF, XRR, Ellipsometry, Raman, and Micro-XRF Enhance metrology capabilities to meet technology roadmap requirements
Roadmap Alignment
Align cross-functional roadmaps (process, equipment, materials, and integration) to ensure synchronized delivery of required capabilities; translate product requirements into actionable metrology development plans
Cross-functional Leadership
Collaborate with global HOC teams, cross-functional partners, and external vendors to ensure metrology solutions are ready
Metrology Definition & Risk Management
Define KPIVs and KPOVs for metrology, and lead risk and gap management activities using FMEA
Problem Solving & Risk Mitigation
Perform root cause analysis and proactively identify risks impacting technology readiness and product schedules
System Development & Deployment
Design, develop, and demonstrate metrology systems that meet process and production requirements
About you
Bachelor’s, Master’s, or higher degrees in STEM (Mechanical Engineering, Physics, Chemistry, Materials Science, or related field)
Experience in technology development, process integration, or thin-film products within manufacturing environments (e.g., HDD, semiconductor, or similar industries)
Experience in Project management and cross-functional coordination
Strong analytical and problem-solving skills, with the ability to translate data into actionable insights
Excellent communication and stakeholder management capabilities
Hands-on experience with XRF, Ellipsometry, XRR, or Raman metrology techniques
Solid understanding of nano-scale thickness measurement (Å–nm scale)
Experience in thin-film modeling and data analysis
Proficiency in data analysis methodologies, including Six Sigma and root cause analysis
Preferred Qualifications
Experience in DLC or semiconductor coating processes and thin-film metrology
Knowledge of SPC, Gage R&R, and metrology system control
Your experience includes
Knowledge of advanced data analytics and modeling tools, including Six Sigma methodologies
Strong critical thinking and problem-solving capabilities
Data-driven decision-making mindset, leveraging structured analysis and quantitative metrics to guide priorities and actions
Proficiency in data analysis tools such as JMP, Minitab, and KNIME
Demonstrated ability to influence and collaborate effectively across cross-functional and diverse technical teams
Proactively identifies and mitigates risks impacting project delivery and execution timelines
Strong presentation and communication skills, with the ability to deliver clear, concise, and executive-ready messages
Location
Our Korat facility is our largest manufacturing site worldwide, with more than 10,000 employees. Here, our team produces cloud-based storage equipment, from individual storage components to finished drives. Employees enjoy ample on-site parking, free shuttle vans and buses within the city of Korat, as well as