Advanced Package Engineer, Principal

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

Advanced Packaging Engineer, Principal

Location: San Jose, CA (On-site).

Astera Labs is seeking Advanced Packaging Engineer, Principal to lead advance packaging R&D for next-generation photonics products for scale up and scale out AI infrastructure applications. This is a senior individual contributor role focused on setting technical direction and driving packaging technology development for NPO and CPO products.

• Lead R&D for advanced packaging of optical chips, including 2.1D, 2.5D, and 3D integration.

• Define and optimize wafer-level, panel-level, or die-level packaging process flows.

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