Intern- PIE PI (Product Integration Engineering, Process Integration)

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location 1 North Coast Drive, Singapore Department Product Integration Engineering (PIE), Process Integration (PI) Project Title NAND Advanced CMOS Metal‑Short Reliability Study and Process Improvement Exploration   Project Description This internship provides a structured learning opportunity within the Process Integration team, focusing on advanced NAND CMOS metallisation concepts and reliability study methodologies. The intern will be introduced to reliability failure mechanisms and evaluation approaches, with exposure to data analytics and AI/ML platforms used to study failure trends and enhance reliability understanding.   Under guidance from the team, the intern will participate in learning activities involving Micron‑customised analytics tools and dashboards, and observe how cross‑functional teams apply data insights to explore and propose potential process improvement ideas.   The intern will have exposure to AI-related initiatives, including the use of automation and analytics tools to improve existing processes and support business outcomes. Objective of the Project The objective of this project is to provide the intern with structured exposure to advanced NAND CMOS metallisation concepts and reliability study methodologies. The project aims to enhance the intern’s understanding of how data analytics and AI/ML platforms are used to study failure trends and support reliability learning in semiconductor manufacturing. Opportunities to be Offered for Full-Time Employment Students who demonstrate strong technical learning capability, analytical thinking, and professional growth during the internship may be considered for future full-time opportunities, subject to business needs and individual performance.   Project Scope   During the internship, the intern will be exposed to: Fundamentals of CMOS metallisation processes and process interactions Overview of process evaluation changes and their impact on wafer characteristics Introduction to Failure Analysis characterisation concepts and fail‑model development approaches Familiarisation with Micron in‑house SMAI analytics tools and dashboards Learning Opportunities Through this project, the student will have opportunities to: Gain exposure to advanced NAND CMOS metallisation concepts and their relationship to device reliability Learn how data analytics and AI/ML platforms are used to study failure trends and support reliability learning Observe cross‑functional collaboration within Process Integration and related engineering teams   Deliverables Learning documentation summarising reliability fail mechanisms studied Preliminary fail‑model observations or insights based on guided analysis Conceptual improvement ideas or observations for discussion with the project team Impact of Project The project will support learning and development in semiconductor reliability engineering while contributing additional technical insights that may aid the team’s continuous improvement and reliability knowledge base.   The candidate will have opportunities to work on AI-enabled and automation-related initiatives that support operational excellence and process improvement. Skillsets Required Basic understanding of semiconductor fabrication processes (preferred) Interest in data analysis, reliability studies, or process learning Willingness to learn and collaborate in a team environment   Course of Interest Engineering and Science (all relevant disciplines)   Duration