Thermal Engineer-Data Center AI GPU Thermal Design

WHAT YOU DO AT AMD CHANGES EVERYTHING   At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.   Together, we advance your career.

Join AMD's Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team and play a key role in shaping the future of AI computing. This team owns the end-to-end thermal architecture, validation, and deployment of AMD's industry-leading MI Series AI accelerators and data center GPU platforms. Engineers on this team work at the intersection of cutting-edge AI hardware, advanced cooling technologies, and large-scale data center infrastructure.   This is an opportunity to collaborate with world-class engineers across silicon design, board engineering, validation, manufacturing, and product development while helping bring next-generation AI products to market. The successful candidate will contribute to thermal innovation from concept through production and gain hands-on experience with advanced cooling technologies that power some of the most demanding computing workloads in the world.   The role offers a unique combination of hands-on laboratory work, thermal modeling, design analysis, and technology development in a fast-paced environment focused on solving complex engineering challenges and enabling AMD's AI roadmap.   THE PERSON: The ideal candidate is a collaborative and technically curious engineer with a passion for solving complex thermal challenges. They are comfortable working in cross-functional environments, taking ownership of their work, and thrive when balancing hands-on experimentation with analytical problem-solving.   Successful team members are self-starters who communicate effectively, execute against commitments, support their teammates, and continuously seek innovative solutions to emerging thermal and cooling challenges. Individuals who bring deep expertise in a specific thermal discipline while maintaining a team-first mindset tend to excel in this environment.

Design and develop thermal solutions supporting AMD's next generation of data center GPU and AI accelerator products. Collaborate with silicon, board, power, validation, manufacturing, and platform engineering teams to deliver innovative thermal-mechanical solutions from component to system level. Perform thermal validation activities including test planning, laboratory experimentation, data collection, and analysis. Contribute to thermal modeling and simulation efforts to support product development and design optimization. Investigate, evaluate, and advance emerging cooling technologies aligned with AMD's future product roadmap. Support product development activities from concept through commercialization and mass production. During the first several months, become familiar with AMD thermal design methodologies, tools, products, and development processes while contributing to active engineering projects. Over time, take ownership of critical thermal design and validation efforts, develop domain expertise, and become a key contributor to next-generation AI platform development.

Strong background in heat transfer, fluid dynamics, and electronics cooling technologies. Experience with thermal management solutions for high-performance computing, data center, server, or AI hardware environments. Experience using CFD tools such as