Senior Thermal/Hardware Engineer

Senior Thermal/Hardware Engineer This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Job Family Definition: Designs, analyzes, develops, and evaluates thermal systems, electronics packaging, heatsinks, and enclosures for high-density, high-power networking platforms. Conducts thermal feasibility studies, design margin analysis, CFD simulation, and empirical validation testing on new and modified designs. Leads system-level thermal architecture development and assessment, driving design decisions across NPI program phases. Evaluates thermal reliability of materials, components, designs, and manufacturing techniques used in production. Directs and guides junior engineers, support personnel, and external partner organizations in detailed thermal design, lab testing, prototype fabrication, and production tooling development. Management Level Definition: Contributions impact technical components of HPE products, solutions, or services regularly and sustainable. Applies advanced subject matter knowledge to solve complex business issues and is regarded as a subject matter expert. Provides expertise and partnership to functional and technical project teams and may participate in cross-functional initiatives. Exercises significant independent judgment to determine best method for achieving objectives. May provide team leadership and mentoring to others.

Lead system-level thermal design, simulation, and validation for high-density, high-power networking platforms — from early concept through mass production — ensuring product performance, quality, and long-term reliability. Own the end-to-end thermal development lifecycle: heatsink design, CFD simulation, thermal mockup, in-lab testing, and data analysis. Design and validate thermal solutions for electronics enclosures, chassis, line cards. Define and execute thermal validation test plans (thermal margin, acoustics, shock/vibration, reliability, safety) Drive system-level design tradeoffs in collaboration with mechanical, electrical, power, firmware, and software engineering teams. Engage manufacturing partners, suppliers, and external development partners to deliver reliable, cost-effective, and production-ready thermal solutions. Represent the thermal team across all phases of large, complex development programs — influencing architecture decisions, managing risks, and driving issue resolution. Lead root-cause analysis and corrective actions during builds and qualification. Provide technical mentorship and guidance to less-experienced engineers, elevating team capability and design rigor across the organization.

Required: Bachelor's or Master's degree in Mechanical Engineering or a related field 10+ years of experience in thermal design and electronics packaging Demonstrated track record of leading thermal development on networking platforms. Knowledge and Skills: Deep expertise in thermal design and electronics packaging for high-density, high-power systems (data center and networking applications). Strong proficiency in CFD simulation tools (FloTHERM), with demonstrated ability to correlate simulation models against lab measurements. Solid