Principal/Senior Advanced Packaging Development Process Engineer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Playing a key role in developing and enabling next-generation advanced packaging technologies for future memory and semiconductor products. This position is responsible for process development, characterization, integration, and qualification of advanced assembly solutions, including hybrid bonding, thermo-compression bonding (TCB), flip chip, and emerging packaging technologies. The engineer will lead technology development activities from concept through qualification and manufacturing transfer, working closely with cross-functional teams including Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality organizations. The successful candidate will drive technical innovation, solve complex process challenges, and accelerate technology readiness to support Micron’s advanced packaging roadmap.

Develop and qualify next-generation advanced packaging and assembly technologies, including Hybrid Bonding, Thermo-Compression Bonding (TCB), Flip Chip, and other emerging packaging solutions. Design, execute, and analyze DOE (Design of Experiments) to optimize process performance, yield, reliability, and manufacturability. Lead process development activities, including process setup, characterization, defect reduction, and process window optimization. Perform technical data analysis and drive root-cause investigations using statistical methods and engineering principles. Collaborate with cross-functional teams to ensure successful technology development, process integration, and high-volume manufacturing readiness. Evaluate and introduce new materials, equipment, and process technologies to enable future product requirements. Drive process troubleshooting, yield improvement, and defect reduction through systematic problem-solving methodologies. Develop and maintain process documentation, qualification reports, specifications, and manufacturing transfer packages. Monitor process health using SPC, FDC, metrology, and reliability data to ensure process stability and capability. Support customer sample builds, engineering evaluations, and technology milestone deliverables. Apply AI, automation, and advanced analytics tools to improve process development efficiency, failure analysis, and technical decision-making. Lead or participate in strategic technology initiatives, supplier engagements, and cross-site development programs.

Master's degree or higher in Materials Science, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, Electrical Engineering, or a related field. Minimum 3 years of experience in semiconductor process development, process integration, advanced packaging, or assembly technology. Hands-on experience in one or more of the following areas: Hybrid Bonding (C2W, W2W, D2D) Thermo-Compression Bonding (TCB) Flip Chip Assembly Advanced Packaging Process Development Strong analytical, statistical, and technical problem-solving skills. Experience with DOE methodologies, data analysis, and process characterization. Demonstrated ability to independently manage complex technical projects in a fast-paced development environment. Fluency in written and verbal communication skills in English. Proven ability to collaborate effectively across global and cross-functional teams.

Experience in HBM, 2.5D/3D Packaging, Chiplet Integration, or Advanced Memory Packaging technologies. Knowledge of package