Thin Film Processing Engineer

Thin Film Processing Engineer Full-time Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Manufacturing Engineering Work Location: San Jose Great Oaks Headquarters--LOC_WDT_USCA23 Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon. We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future. Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too. We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands. Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Responsible for sustaining the vacuum thin film deposition using PVD/IBD processes, and characterize thin film properties, such as XRF, XRR, TEM, BH-Looper, and other magnetic properties. Responsible to analyze the wafer processing and probing results. To correlate the wafer probing results to wafer individual processing steps and materials to create action items and recommendations to resolve the production yield and quality issues. To perform and/or coordinate wafer level failure analysis activities related to reader thin film deposition processes, such as TEM analysis, wafer level SPC audit to identify possible root causes for all released products. Work with advanced reader development group to transfer new deposition processes into production as well as qualify new tools.

BS or MS Degree in Engineering, Physics, Materials Science or a related field. Good communication skills 2 yrs of thin film deposition related work experience preferred Magnetic background preferred. Strong statistical data analysis skills are preferred.

Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our non-discrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the Equal Employment Opportunity is the Law poster. Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to