Low Power Analog-Mixed Signal Technologist, Senior Director

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > ASICS Engineering General Summary: The Senior Director of Low Power Analog & Mixed-Signal Technologist will serve as the key technology and organizational leader responsible for defining and executing the long-term strategy for advanced sensing, mixed-signal semiconductor platforms, and intelligent edge systems. This leader will drive innovation and product differentiation across Robotics, Extended Reality (XR), Industrial IoT (IIoT), Intelligent Sensors, and AI-enabled embedded platforms. The role requires a unique combination of deep technical expertise, executive leadership, business acumen, and cross-functional influence. The successful candidate will work with multiple engineering organizations and senior technical leaders while shaping technology roadmaps, investment priorities, ecosystem partnerships, and multi-generation platform strategies. This position will play a critical role in developing technologies for next-generation sensor ASIC IP, mixed-signal subsystems, intelligent sensing architectures, and edge AI platforms, while ensuring alignment between technical execution, customer requirements, and business objectives.

Ph.D. in Electrical Engineering, Computer Engineering, or related discipline with 10+ years of relevant industry experience OR M.S. in Electrical Engineering, Computer Engineering, or related discipline with 14+ years of relevant industry experience Additionally: Proven experience leading large engineering organizations consisting of directors, managers, architects, and senior technical contributors. Extensive expertise in low-power analog, mixed-signal, sensor, and semiconductor system architecture. Demonstrated success defining and delivering complex semiconductor products from concept to high-volume production. Experience leading global cross-functional teams spanning silicon development (pre/post bringup), firmware, software, validation, packaging, manufacturing, and product engineering. Strong track record of driving technology strategy, technical innovation, and organizational transformation. Experience managing external partners, technology suppliers, foundries, IP providers, and strategic ecosystem relationships. Demonstrated ability to influence executive leadership and business stakeholders through technology vision and execution excellence. Leadership and Technical Responsibilities Technology Strategy and Vision Define and own the long-term technology roadmap for low-power analog, mixed-signal, sensing, and intelligent edge computing platforms. Drive technology planning for Robotics, XR, Industrial Automation, Intelligent Sensors, and Edge AI applications. Organizational Leadership Build a high-performance engineering culture focused on innovation, execution excellence, technical rigor, and continuous learning. Foster collaboration across global cross-functional engineering organizations and external technology partners. Drive engineering process improvements, quality initiatives, and operational excellence across the organization. Mentor senior technical teams across systems engineering, platform integration, and architecture execution. Technical Leadership Provide executive oversight of system architecture across sensing, mixed-signal ICs, AI processing, embedded software, communication interfaces, packaging, and system integration. Guide architecture tradeoffs involving power, performance, scalability, latency, reliability, safety, security, and cost. Lead technology review boards and critical architecture decision forums. Drive development of platform architectures that enable reusable technologies across multiple product families and business segments. Champion innovation through patents, publications, strategic research initiatives, and industry engagement. Ecosystem and Industry Leadership Build strategic relationships with customers, suppliers, foundries, technology