Advanced Packaging & Integration Engineer

The application window is expected to close on: 08/07/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . Cisco is seeking a highly capable Advanced Packaging engineer to join Cisco's Packaging Technology & Quality team within our world-class Global Supply Chain. You will be instrumental in driving advanced packaging technology development to support Cisco’s ground breaking silicon photonic technology roadmap including optical engines, co-packaged optics and on-board optics. The ideal candidate brings broad packaging technology experience and a strong curiosity to pursue innovative solutions.

You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and cross-functional environment. You will engage directly with counterparts at OSATs, foundries, and key suppliers to drive the development of innovative packaging technologies—specifically focused on heterogeneous integration—from early-stage conceptualization through qualification. This role offers significant cross-organizational visibility and the opportunity to shape critical technology roadmaps and influence long-term product platforms.

Advanced packaging technology development engineer focused on silicon photonic packaging and electronic-photonic integration, including 2.5D/3D chip stacking, heterogenous integration, and ultra-fine pitch interconnect technologies. Drive definition, design and analysis of packaging technology test vehicles. Drive validation of new technology against key performance metrics. Apply deep process expertise to oversee wafer processing, fine pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly. Work with top-tier foundry and assembly partners to develop and qualify robust packaging solutions for high density photonics integration, CPO and on-board optics. Utilize design and modeling experience to guide Design for Manufacturability (DfM) and Design for Reliability (DfR). Identify and mitigate risks, resolving highly complex packaging issues through advanced root cause analysis and the implementation of corrective actions.

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field. 4+ years of progressive industry experience in advanced packaging with a proven track record of successful project execution in high-density integration. Comprehensive knowledge of advanced interconnect materials, process and assembly, including ultra-fine pitch technologies and hybrid bonding. Hands-on experience with CAD tools such as kLayout, APD, Solidworks Preferred Qualifications Knowledge of physical failure analysis methods. Hands-on experience with hybrid bonding and thin die/wafer processing Working knowledge of finite element analysis Deep understanding of next-generation substrate and PCB design and materials, and their influence on packaging performance. Expertise in si photonic co-integration (CPO, NPO) is a plus Proven ability to work effectively within highly multi-functional and geographically distributed technical teams.   Why Cisco?  At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions