APEC Application Development Engineer – Tyvek® Consumer & Industrial

At DuPont, our purpose is to empower the world with essential innovations to thrive. We work on things that matter. Whether it’s providing clean water to more than a billion people on the planet, producing materials that are essential in everyday technology devices from smartphones to electric vehicles, or protecting workers around the world. Discover the many reasons the world’s most talented people are choosing to work at DuPont. Why Join Us | DuPont Careers INTRODUCTION   This position is based   in   one   the APEC offices of   D uPont , a global leader in protective materials.   As   Application Development Engineer , you will play a pivotal role in supporting customer needs by driving the development of new applications,   by   leading   the development of new products   and   providing   expert technical guidance on the use, handling, and management of DuPont   Tyvek®   products.     ROLE & RESPONSIBILITIES   In this role, you will:   Industry & Customer Engagement:   Act as the primary technical interface between DuPont and semiconductor customers across Taiwan and the broader APAC region.   Develop strong relationships with wafer manufacturers, OSATs, advanced packaging companies, IC substrate producers, packaging material converters, and equipment suppliers.   Lead technical discussions, application reviews, product evaluations, and qualification activities with customers.   Application Development   Drive the development of new Tyvek® applications in interleafing & active packaging.    Identify   unmet customer needs and translate them into application concepts, product requirements, and commercialization opportunities.   Technical Leadership   Serve as the internal subject matter expert (SME) for semiconductor packaging, contamination control, ESD management, moisture protection, and interleafing applications.   Lead root-cause investigations and problem-solving activities related to particle contamination, ionic contamination, ESD performance, material handling, automation compatibility, and product performance.   Collaborate closely with global R&D, Product Management, Manufacturing, and Quality teams to develop and   optimize   solutions.   Product Qualification & Commercialization   Support customer qualification activities through test planning, data analysis, and performance validation.   Generate technical evidence supporting key customer requirements   Drive   specification-in   activities and support commercial adoption.

Education & Experience:   Required   Master’s degree in   Elec tronic   Engineering ,   Physics,   Material Science,   Chemical Engineering,   or   a related field .   Minimum 5 years of experience in semiconductor materials, packaging materials, wafer handling, contamination control, semiconductor packaging, substrate manufacturing, or related applications.   Proven experience working directly with semiconductor customers in technical development, process engineering, application engineering, or product development roles.   Experience supporting cleanroom manufacturing environments.   Experience leading customer-facing technical projects from concept through commercialization.   Preferred   Experience with semiconductor interleafing, wafer separators, IC substrate packaging, desiccants, cleanroom packaging, ESD packaging, or contamination-control materials.   Familiarity with semiconductor ecosystem companies such as foundries, memory makers, OSATs, substrate manufacturers, and packaging converters.   Knowledge of wafer fabrication, advanced packaging, chiplet architectures, AI/HPC supply chains, or semiconductor   logistics .   Experience with material qualification and semiconductor quality requirements. ​   Skills & Competencies:   Strong analytical, creative, and conceptual thinking skills; results-driven mindset.   Excellent communication skills (written and oral) in English;