Module Development Engineer, Defect Inspection

Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection , where you will help enable next-generation semiconductor innovation. In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes. You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies. What You’ll Do Key responsibilities will include but not limited to: Develop and implement defect inspection and metrology technologies for semiconductor manufacturing. Design and optimize processes, inspection methods, and equipment performance. Conduct process experimentation and feasibility studies using statistical and engineering methods (DOE, SPC). Collaborate with equipment and materials suppliers to introduce new technologies. Analyze defect data to identify root causes and improve yield and quality. Drive continuous improvement of inspection systems through automation, software, and hardware enhancements. Support technology pathfinding and roadmap development for next-generation products. Stay current with industry trends, emerging tools, and inspection methodologies. Behavioral traits that we are looking for candidates who: Collaborate effectively across teams and disciplines Show curiosity and continuous learning mindset Demonstrate strong analytical and problem-solving skills Can adapt to changing priorities in a dynamic environment Communicate technical concepts clearly to diverse audiences Take ownership and accountability for results Drive innovation while maintaining attention to detail Why Join Us Work on cutting-edge semiconductor technologies Opportunity to influence high-volume manufacturing and future nodes Collaborative, inclusive, and innovation-driven environment Career growth through challenging technical opportunities Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.  See  Intel Benefits  for more details.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Note: For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information     Minimum Qualifications and Experience : Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field + 4 years of experience.  Or a Master's degree in the same field with 3+ years of experience and a PhD in the same field with  2+ years of experience. Your experience described above must be in the following: Semiconductor processing, system controls, opto-mechanics, or mechanical systems. Statistical Process Control (SPC) and Design of Experiments (DOE) principles.   Preferred Qualifications and Experience : Demonstrated ability to troubleshoot manufacturing processes and equipment. Experience with packaging processes, equipment automation development, or project management in technology development. Previous related work experience in a semiconductor foundry preferred We invite you to bring your expertise and creativity to Intel, where you will have the opportunity to innovate, collaborate, and shape the future of semiconductor technology. Apply now and become an integral part of our dynamic team.             Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color,