Product Planning Engineer-ASIC/SoC

WHAT YOU DO AT AMD CHANGES EVERYTHING   At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.   Together, we advance your career.

This position is responsible for Product Planning of next-generation AMD Adaptive and Embedded Computing products, with a focus on ASIC, SoC, FPGA, Adaptive SoC, and semi-custom product definition. The role drives product strategy, roadmap planning, and product requirements by translating customer needs, market opportunities, business objectives, and engineering capabilities into actionable product definitions. A significant aspect of this role is driving product requirements related to power efficiency, thermal performance, packaging, quality, reliability, manufacturability, and performance per watt. The individual serves as a key technical and business point of contact across product planning, architecture, engineering, product engineering, packaging, quality, validation, manufacturing, marketing, and customer-facing teams. The successful candidate will partner with engineering organizations to identify product-level opportunities and influence technical direction through requirements, customer insight, competitive analysis, and data-driven product planning rather than direct implementation ownership. THE PERSON: A successful candidate can independently drive product planning activities and influence technical decisions across multiple engineering organizations. The ideal candidate combines strong technical understanding of semiconductor products, system architecture, and product development with the ability to translate customer needs, market trends, and technical constraints into structured product requirements. The candidate understands how architecture, implementation, packaging, reliability, quality, manufacturing, validation, and thermal decisions affect overall product competitiveness and can effectively challenge assumptions, identify risks, and drive improved product outcomes through requirements and technical influence. This role requires credibility with engineering organizations and the ability to engage deeply in technical discussions while maintaining a broader product, customer, and business perspective. Comfort with ambiguity is essential. The candidate must be able to create structure, evaluate alternatives, and drive decisions when requirements, constraints, or priorities are not fully defined.

Drive product planning activities for future ASIC, SoC, FPGA, Adaptive SoC, and semi-custom products. Gather and translate customer, market, business, and system requirements into product requirements, product definitions, and roadmap recommendations. Drive product requirements and planning activities across performance, power, thermal, quality, reliability, manufacturability, packaging, and performance-per-watt dimensions. Collaborate with architecture, design, product engineering, quality, validation, packaging, manufacturing, and business teams to ensure product requirements appropriately balance customer needs, product competitiveness, implementation complexity, and business objectives. Identify product-level risks and opportunities associated with power delivery, thermal solutions, packaging technologies, reliability targets, manufacturability, qualification, and quality objectives and ensure they are reflected in planning decisions. Influence