Principal Product Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission. The Compute/AI Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt & Maia. Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon, Manufacturing, and Packaging Engineering ( SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Principal Product Engineer to join the team.

Responsible for product/test engineering for new product development and manufacturing. The position requires someone with experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging. Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on. Drive Power and Performance tuning during post-Si phase in partnership with platform teams. Drive ATE test program implementation to optimize for SOC power/TDP. Work closely with platform/system engineers to drive necessary correlation work to enable such optimizations. Drive product manufacturing fuse requirements and end to end data flow for fusing across various test sockets. Successful candidates should have strong project leadership skills to manage external vendors, drive cross functional teams and drive sub-projects as part of larger development programs. They should also have excellent knowledge of ATE test program development including test method development, test bring-up, characterization, debug, and yield analysis. The candidate should also have knowledge of DFT, silicon fabrication process, product Q&R, and basic transistor theory. The candidate would benefit from a background in various product market areas such as high-performance computing, AI, GPUs, CPUs. Overall product engineering role taking product from definition to launch.

Required/minimum qualifications Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.   Other Requirements Ability to meet Microsoft, customer and/or government security screening requirements are