Firmware Architect – High-Speed Interconnect (PCIe / OCI)

WHAT YOU DO AT AMD CHANGES EVERYTHING   At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.   Together, we advance your career.

AMD is transforming the industry with our EPYC server platform and AI-centric graphics solutions. Our mission is to design world-class products that power the next generation of Data Centers, Artificial Intelligence (AI), High Performance Computing (HPC), and next‑generation server platforms. If you are passionate about defining next-generation interconnect architectures and firmware innovation, join our Data Center organization to help shape the future of scalable, high-performance systems.     THE PERSON:   We are seeking a highly experienced Firmware I/O Interconnect Architect to lead the definition and evolution of next-generation firmware architectures for high-speed interconnects. This role will focus on PCIe Gen 6/7/8 and emerging Optical Component Interconnect (OCI) technologies, driving scalable, high-performance, and robust solutions across AMD’s server platforms. You will play a key role in shaping firmware architecture strategy, influencing silicon design, and enabling industry-leading interconnect capabilities.

Firmware Architecture Leadership: Define and drive firmware architecture for next-generation I/O interconnects, including PCIe Gen 7/8 and OCI, ensuring scalability, performance, and robustness. Interconnect Innovation: Lead the adoption and integration of advanced interconnect technologies, collaborating with hardware architecture and silicon teams to influence design decisions and standards alignment. Cross-functional Collaboration: Partner with system architecture, silicon design, validation, and platform software teams to deliver cohesive end-to-end solutions across pre- and post-silicon phases. Platform Bring-up & Debug: Guide platform bring-up, debug, and optimization for complex I/O subsystems, ensuring high reliability and performance in production environments. Standards & Ecosystem Engagement: Stay at the forefront of industry trends and standards (PCIe, CXL, OCI), contributing to AMD’s leadership in next-generation interconnect ecosystems.

Extensive experience in firmware and system architecture with a focus on high-speed I/O and interconnect technologies. Deep expertise in PCIe (Gen 4/5/6+) with strong familiarity or emerging knowledge of PCIe Gen 7/8 and Optical Interconnect technologies. Strong understanding of server platform architecture, including CPU/GPU interconnects, memory hierarchy, and high-speed signaling constraints. Proven experience in firmware design for complex hardware/software interfaces and system-level flows (boot, enumeration, link training, error handling). Experience with platform bring-up, pre/post-silicon validation, and debugging complex I/Oand firmware issues. Demonstrated ability to influence architecture and drive cross-organizational alignment. Excellent communication skills with the ability to operate effectively at architecture, implementation, and executive levels.   ACADEMIC CREDENTIALS:   Bachelor’s or Master's degree in Computer Science, Computer Engineering, Electrical Engineering, or equivalent     LOCATIONS: Austin, TX, Santa Clara, CA or Markham, Ontario, Canada     This role is not eligible for visa sponsorship.   #LI-AG1