Senior Staff Power and Thermal Manufacturing Debug Engineer

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Technical, hands-on engineer responsible for post-silicon manufacturing validation and debug of AMD Data Center GPU products, with end-to-end ownership of power, thermal, voltage, and frequency (PTVF) characterization and test coverage optimization.

Manufacturing Test Coverage Development: Define and deploy robust post-silicon manufacturing test plans to ensure comprehensive coverage across power, thermal, voltage, and frequency operating conditions. Silicon Debug & Root Cause Analysis: Lead deep-dive debug of manufacturing and system-level failures, driving rapid root cause identification across silicon, firmware, platform, and test infrastructure. PPA Optimization & Characterization: Analyze PPA (Power, Performance, Area) trade-offs and optimize coverage to ensure product meets performance targets while maintaining thermal and power efficiency across HVM conditions. Voltage/Frequency & Thermal Validation: Validate stability and guard-banding across DVFS states, thermal corners, and real-world workloads to ensure robust operation under diverse deployment scenarios. Yield & Quality Improvement: Drive data-driven insights from manufacturing and field returns to improve test effectiveness, enhance fault detection, and increase final product yield and reliability. Cross-Functional Collaboration: Partner with silicon design, firmware, platform, and manufacturing teams to close gaps, implement design/test fixes, and enable scalable validation flows for volume production.

Strong Post-Silicon Debug Expertise: Proven experience in silicon bring-up, manufacturing test debug, and failure analysis for complex SoCs or GPU/CPU platforms. Deep PPA / PTVF Domain Knowledge: Solid understanding of power management, DVFS, thermal behavior, voltage guard-banding, and performance optimization in high-performance computing systems. Manufacturing Test & Coverage Development: Experience designing and optimizing high-volume manufacturing test flows (ATE, system-level test) with focus on coverage efficiency and defect screening. Hands-On Debug Skills: Strong capability in lab-based and fleet-level debug using logs, telemetry, and instrumentation; comfortable working across Linux environments, scripting (Python/Bash), and data analysis. Cross-Layer Debug Capability: Ability to root-cause issues across hardware, firmware, drivers, and system interactions with a structured, data-driven approach. Data Analytics & Insight Generation: Skilled in analyzing large-scale manufacturing or fleet data to identify trends, systematic failures, and opportunities for yield/quality improvement. High-Performance Platform Experience: Prior experience with datacenter GPUs/accelerators, servers, or large-scale compute systems is highly desirable. Cross-Functional Collaboration & Leadership: Demonstrated ability to lead debug efforts across global teams and influence design/test decisions to improve product quality and manufacturability. ACADEMIC CREDENTIALS: Bachelor’s degree or higher in Electrical/Computer Engineering or Electronics / Mechanical Engineering related with a minimum 5-7 years of experience in SoC thermal validation and debug. LOCATION: Penang, Malaysia