DIRECTOR, External Manufacturing Operations (Backend Engineering)

WHAT YOU DO AT AMD CHANGES EVERYTHING   At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.   Together, we advance your career.

This Position is for Director, EMO_BackEnd Engineering stationed in Hsinchu, Taiwan. The Ideal Candidate will have a balanced mix of strong technical knowledge as well as Leadership experience in Substrates & PCB MFG & Advanced Packaging Functions. You will be responsible for driving key performance metrics related to NPI projects, HVM Sustaining, supplier site HVM readiness, process optimization, and improvements in areas like Yield and CIP’s apart from BCP.   THE PERSON: The successful candidates must be strong team player with a commitment to lead & drive for solutions and an aptitude to thrive & ability to work in a fast-paced multi-tasking environment and meet deadlines . He or she would have excellent cross functional project management skills, data analysis skills to effectively manage substrate/pcb suppliers, conflict management skills, strong interpersonal skills, people management skill on career planning & development, day to day & regular coaching & monitoring. Proficiency in English (speaking, writing, and presenting) is essential.

Plan, Drive and Manage Substrate & PCB supplier and AMD internal stakeholders from NPI bring up/Qualification/ Ramp Up readiness to Production release and sustaining. Supplier Qualification - NPI to LVM to HVM, with First pass and Issue free production for 6 months to ensure Repeatability and Reproducibility. Substrate & PCB supplier’s new production site bring up & qualification. Drive HVM yield attainment, sustaining-issue resolution and issue prevention and improvements through Data Analytics. System Integration with Data Analytics to have real time update and control over supplier overall performance. Lead knowledge-sharing initiatives (Best Known Methods, lessons learned) and drive Continuous Improvement Projects (CIPs). Monitor & Drive supplier performance using scorecards and lead quarterly technical reviews to ensure improvements. Lead projects to drive cross supplier performance improvement/quality enhancement Drive for supplier engagement on continuous improvement. Drive supplier to enhance process, equipment & material capability for future generation/technology products and capabilities ahead of roadmap needs. Plan and execute change management. Responsibilities will include defining and managing Key Program deliverables/schedules/budget/Analyze program risk and opportunities & monitor progress to drive to ensure goals are met. Self-Driven/Lead, manage, develop a motivated high-performance team with Improved bench strength and drive to achieve Next 5% to continue to stay ahead of the curve. Reach-out before Reached with respect to RnR. Build effective team and strategic relationship across the network. Manage and resolve conflicts. Involve in regional supplier management. Job may include other duties as assigned/ deemed fit by supervisor.

Minimum 20 years+ experience in IC Substrate/PCB Engineering & Operations or with Fabless companies (Managing substrate suppliers).. Experience in Co-working/managing horizontally across multiple internal functional organizations. Technical expertise in FC-BGA, LGA, Adv PKG Substrates & PCB Manufacturing /Development and related