Senior Manager, PDE Process Integration (PI)
Micron Technology
- Location
- Fab 10A, Singapore
- Work model
- On-Site
- Level
- Senior
- H-1B history
- 69 approvals (FY2023)
- Posted
- 8h ago
About this role
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. At Micron, we believe in encouraging a culture of innovation and excellence. The PDE Process Integration (PI) Senior Manager role offers an outstanding chance to lead a distributed team in defining, standardizing, and driving High Bandwidth Memory (HBM) New Product Introduction (NPI) success across several locations. This position blends strategic leadership, scaling of operations, and coordination across sites. It aims to ensure consistent PI readiness, faster yield ramp, and strong risk management from development through High Volume Manufacturing (HVM).
Job Responsibilities
Define and drive PI strategy, standards, and guidelines across HBM programs. Coordinate PI execution across multiple HBM NPI programs, ensuring delivery against network-level achievements and ramp targets. Ensure robust risk identification, early detection mechanisms, and mitigation strategies. Serve as the central PI leader collaborating with various engineering and manufacturing organizations. Champion the adoption of AI-enabled tools for yield analysis and risk prediction. Organizational Leadership & Talent Strategy Guide and grow a group of PI managers and senior engineers spanning several locations or departments. Build a strong leadership bench through succession planning and capability development. Promote a climate of ownership, responsibility, and constant development across the organization. Collaborate with site leaders to maintain uniform talent quality and organizational well-being. Central PI Strategy & Governance Establish governance frameworks for PI execution, including phase gates and blocking issue models. Ensure alignment of PI methodologies across sites for consistency and scalability. Drive standardization of NPI execution models, metrics, and reporting. HBM NPI Leadership Across Network Ensure effective synchronization of development-to-HVM transitions across sites. Balance resource prioritization across sites and programs to meet critical business commitments. Act as owner for critical cross-site integration risks involving blocking issues. Technical Leadership & Risk Management Provide top-level technical direction on process integration strategies and problem-solving approaches. Drive structured root cause analysis frameworks and ensure high-quality corrective action closure. Sponsor complex problem-solving efforts that span multiple modules, functions, or locations. Cross-Functional & Executive Collaborator Engagement Align senior collaborators on roles, decision ownership, and tradeoffs across sites. Communicate program status, risks, and strategic priorities to executive leadership. Drive alignment between development, manufacturing, and partner sites. Driving AI-Enabled Transformation Identify and scale high-impact AI use cases. Establish guidelines for responsible AI usage aligned with organizational and legal requirements. Build a data-driven culture by integrating analytics and automation into PI workflows. Job Requirements Bachelor’s or Master’s degree in Engineering or a related field, or equivalent experience. 12–15+ years of semiconductor engineering experience with deep PI/NPI expertise. Proven leadership experience managing managers and/or cross-site teams. Proven history of leading large-scale NPI implementation and yield ramp across complex programs. Excellent collaborator management and executive communication skills.
Preferred Skills
Experience in advanced packaging, HBM, or 3D-stacked technologies. Proven