Director, Advanced Packaging Lab (HIT)

WHAT YOU DO AT AMD CHANGES EVERYTHING   At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.   Together, we advance your career.

AMD’s Heterogenous Technology Integration (HIT) team is seeking an experienced leader to establish its Singapore Advanced Packaging Lab, a multi-disciplinary lab focused on accelerating the development of advanced packaging technologies for AMD’s AI product portfolio.   THE PERSON:   The team will enable and maintain metrologies across optical, electrical, mechanical, thermal, and imaging domains, while also identifying and partnering with external labs, equipment vendors, universities, and industry collaborators to develop new measurement capabilities. Beyond core metrology work, the team will support simulation, physical design, and other lab-related activities, and may interface with Asia-based manufacturing partners.   The ideal candidate will have direct experience managing and scaling technical teams, along with a strong network within the Singapore tech ecosystem to support team growth and partnership development. Hands-on experience in one or more of the technical areas mentioned will be advantageous. Additional strengths include strong presentation skills to effectively engage and influence US-based partner teams, a proven track record of working with equipment suppliers to develop innovative instruments and metrologies, and familiarity with leveraging agentic AI to drive productivity.

The Director of the Singapore Advanced Packaging Lab will build and lead a multidisciplinary team to establish and scale advanced measurement and characterization capabilities across key domains, including: Optical: Drive characterization of optical interconnects at component and channel level to support next-generation packaging architectures. Electrical: Lead characterization of passives (capacitors, inductors), high-speed IO structures, and electrical properties of packaging materials. Mechanical: Oversee measurement of mechanical properties of packaging materials, including warpage and structural integrity of substrates and fully assembled packages. Thermal: Establish capabilities to evaluate thermal properties of next-generation TIMs and materials, including development of short-loop thermal test vehicles to assess future packaging architectures. Imaging: Develop and expand advanced imaging capabilities, including optical and electron microscopy, X-ray imaging, and spectroscopy. In addition, the role will: Define and execute the lab’s technical roadmap in alignment with AMD’s AI packaging strategy. Build and scale a high-performing team with deep domain expertise across metrology and characterization. Drive collaboration with global engineering teams (design, simulation, manufacturing) and external partners to accelerate capability development. Establish strong partnerships with equipment vendors, research institutions, and ecosystem partners to enable innovation in measurement technologies. Engage with Asia-based manufacturing partners to ensure alignment between lab capabilities and production needs.   PREFERRED EXPERIENCES: Extensive experience in advanced packaging, metrology, characterization, and design validation of semiconductor components, packages, and platforms, with a strong understanding of end-to-end development lifecycles from