Failure Analysis and Reliability Engineer

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We are looking for a Quality Engineer II to support component- and board-level failure analysis for advanced semiconductor products. In this role, you will perform electrical verification, fault isolation, physical failure analysis, board-level analysis, reliability stress support, and clear technical reporting. This is a hands-on engineering position suited for someone who enjoys solving complex technical problems, working across teams, and driving issues from initial investigation through root-cause conclusion. Job level will be aligned to the selected candidate’s experience. You will be part of a technical team focused on solving challenging semiconductor quality and reliability problems. This role offers the opportunity to build deep hands-on failure analysis expertise, work with advanced products and analytical tools, and contribute directly to product quality, reliability, and customer success.

Perform component- and board-level failure analysis to determine root cause of product or board failures. Conduct electrical verification, fault isolation, and physical failure analysis using appropriate tools and techniques. Perform board-level dye-and-pry analysis, PCB construction analysis, and physical failure analysis of PCB assemblies. Support board-level reliability stress testing and bench testing before and after stress exposure when needed. Document analysis results in clear, accurate failure analysis reports with evidence-based conclusions and recommended next steps. Work with cross-functional engineering teams to investigate issues, communicate findings, and support corrective actions.

Bachelor’s degree in Electrical Engineering, Materials Science, or a related technical field. 1–3 years of experience in semiconductor failure analysis, product quality, reliability engineering, board-level analysis, or a related technical area. Hands-on experience with electrical fault isolation and physical failure analysis methods. Ability to analyze technical data, draw logical conclusions, and communicate results clearly in written reports. Strong problem-solving skills, attention to detail, and ability to manage investigations with limited supervision.

Experience with dye-and-pry testing in accordance with IPC-TM-650 methods. Experience with precision cross-sectioning, parallel lapping, chemical deprocessing, or related physical analysis techniques. Familiarity with failure analysis tools and techniques such as curve tracing, C-SAM, X-ray, TDR, OBIRCH, thermal emission microscopy, and SEM. Knowledge of semiconductor reliability stress testing, CMOS devices, circuit analysis, diagnostic techniques, IC fabrication, and assembly processes. Ability to collaborate effectively with cross-functional engineering, quality, reliability, and product teams. This role is not eligible for visa sponsorship.   #LI-LR1329 Benefits offered are described:  AMD benefits at a glance .   AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to