Physical Design Lead(High Speed IP's)

WHAT YOU DO AT AMD CHANGES EVERYTHING   At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.   Together, we advance your career.    PMTS SILICON DESIGN ENGINEER THE ROLE AMD is looking for an experienced and highly motivated Principal Member of Technical Staff (PMTS) to join the CT Physical Design team. In this role, you will drive the physical implementation of industry-leading high-speed interface IPs including DDR, LPDDR, GDDR, PCIe, and other next-generation mixed-signal PHY solutions used across client, server, and graphics products. As a technical leader, you will work closely with architects, circuit designers, RTL, package, power integrity, signal integrity, SoC, and methodology teams to define and implement innovative physical design solutions that achieve aggressive PPA, frequency, power, and schedule goals on advanced process nodes. The ideal candidate combines deep physical design expertise with strong leadership capabilities and a proven track record of delivering complex, high-performance IPs to production. THE PERSON You are passionate about solving complex physical design challenges in advanced semiconductor technologies. You thrive in fast-paced environments, influence technical direction beyond your immediate team, and enjoy mentoring engineers while driving innovation in implementation methodologies. You possess deep understanding of high-speed digital and mixed-signal design implementation and have successfully delivered multiple tape-outs in advanced technology nodes.

Lead physical design implementation of complex high-speed IPs such as DDR/LPDDR/GDDR PHYs, PCIe, SerDes, and related subsystems. Drive architecture and physical design co-optimization to achieve industry-leading Power, Performance, and Area (PPA). Own end-to-end implementation activities including: Floorplanning Power planning Placement Clock architecture CTS Timing closure Signal integrity closure Physical verification Tapeout signoff Drive high-frequency timing closure for challenging datapaths and clock distribution networks. Partner with architects and circuit designers to optimize PHY architectures for performance, power, and implementation efficiency. Develop and deploy innovative implementation methodologies to improve design quality, productivity, and scalability. Collaborate with cross-functional teams including Architecture, RTL, AMS, Package, SI/PI, Product Engineering, SoC, CAD, and EDA vendors. Debug and resolve complex implementation, silicon correlation, and post-silicon issues. Provide technical leadership for multiple projects and influence implementation strategies across organizational boundaries. Mentor SMTS/MTS engineers and help grow the technical capability of the organization. Drive continuous improvement initiatives in automation, AI-assisted design methodologies, and signoff flows.

15+ years of industry experience in Physical Design for advanced semiconductor products. Proven track record delivering multiple successful tape-outs on advanced technology nodes (N3/N4/N5 or equivalent). Extensive experience with high-performance and high-speed interface IPs such as: DDR4/DDR5/LPDDR5/LPDDR6 GDDR PCIe Mixed-signal PHYs Deep expertise in: Timing closure Clock design Physical implementation Power optimization Signal integrity Multi-voltage design methodologies Strong