Engineering Specialist III - D Shift

As a Wafer Process Engineering Technician, you play a critical role in supporting Seagate’s thin‑film head manufacturing. You will partner closely with process and sustaining engineers to control processes, evaluate tool performance, execute data‑driven troubleshooting, and ensure the highest quality of recording head wafers. This position requires strong analytical skills, comfort working with data, and the ability to apply structured problem‑solving in a fast‑paced production environment. This role supports a complex, high‑reliability operating environment where sustained mental focus, continuous learning, and sound judgment are required throughout extended shifts. About the role - you will:

1. Process Control, Optimization, and Qualification

Evaluate tool and wafer datasets using statistical reasoning (SPC charts, distributions, correlation patterns) to determine appropriate next steps. Perform analytical review of qualification data using trend interpretation, slope/line‑fit reasoning, and simple statistical testing to verify process stability before adjusting. Apply calculations including ratios, offsets, tolerance windows, and proportional adjustments when determining parameter changes. Navigate tool software interfaces to input, modify, and verify parameter changes in alignment with process control requirements. Distinguish between normal process variation and true assignable causes using critical thinking and historical baseline comparison.

2. Data Analysis and Troubleshooting

Use structured problem‑solving techniques (cause/effect reasoning, elimination testing, logic trees) when troubleshooting suspect processes. Evaluate parameter impacts using quantitative reasoning, including linear relationships, proportional adjustments, and tolerance‑based thresholds. Use tool data logs, KPIV (Key Process Input Variable) datasets, and wafer parametric information to identify trends, isolate suspect parameters, and support evidence‑based problem solving. Combine tool logs, wafer data, and historical patterns to differentiate between equipment‑driven and process‑driven issues before escalating to engineering. Synthesize findings into evidence‑based recommendations for engineering, escalating only when analysis indicates non‑routine deviation. Participate in cross‑functional teams focused on yield improvement, scrap reduction, and reaction plan effectiveness.

3. Materials Deviation Authorization (MDA)

Execute established engineering rules and procedures for non‑conforming wafers. Analyze rework and scrap data to determine root cause and corrective action. Apply root‑cause analysis grounded in data patterns (trends, distributions, frequency analysis). Distinguish between process‑induced, equipment‑induced, and material‑induced variation. Follow established escalation guidelines and decision frameworks, including notifying Engineers when required.

4. Cycle Time Enhancement

Collaborate with production teams to analyze bottlenecks and recommend data‑driven solutions. Resolve factory floor engineering issues, escalating to engineering shift support when necessary.

5. Training and Documentation

Provide training for new technicians. Continuously learn additional manufacturing areas as experience is gained. Identify and suggest improvements to process engineering documentation used to control and qualify tools. Translate analytical findings into clear documentation that supports engineering decisions and shift‑to‑shift knowledge transfer.

6. Engineering Support

Monitor special processes, make adjustments, and document results. Support engineering staff with trials, experiments, and manual runs. Function as the “eyes and ears” of the Sustaining organization and process engineering team. Identify and escalate issues related to wafers, processes, systems, or documentation.

7. Health and Safety Compliance

Ensure