Packaging Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING   At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.   Together, we advance your career.

Help turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies. We are seeking a highly motivated and technically strong Member of Technical Staff (MTS) to support the package design organization in the development and deployment of AI-driven automation workflows. This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design. The candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies. This role operates in a fast-paced, results-oriented environment and plays a critical part in enabling next-generation packaging innovation   THE PERSON:   The ideal candidate is a hands-on technical contributor with a strong foundation in advanced packaging design and automation, combined with a passion for applying AI/ML techniques to engineering workflows. They are expected to: Translate complex design challenges into scalable automation solutions Work effectively across Design, EDA, and AI/ML teams Demonstrate strong problem-solving skills and ownership mindset Operate with limited supervision, delivering high-quality results aligned to project goals The candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders.

Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration. Apply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification. Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality. Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams Support execution of design milestones and tape-outs, ensuring automation readiness and quality Contribute to documentation, best practices, and reusable workflows for broader team adoption   PREFERRED EXPERIENCE:   5+ years of experience in semiconductor packaging or SOC physical design automation Strong working knowledge of EDA packaging tools such as Cadence APD / SiP, Siemens Xpedition and Synopsys 3DICC or equivalent Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++ Experience applying AI/ML techniques to engineering or design workflows. Familiarity with frameworks such as PyTorch or TensorFlow . Understanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and